Isikhuntaidlala indima ebaluleke kakhulu embonini yanamuhla, futhi ikhwalithi yayo inquma ngqo ikhwalithi yomkhiqizo. Ukuthuthukisa impilo yesevisi kanye nokunemba kwayoisikhuntakanye nokunciphisa umjikelezo wokukhiqiza isikhunta kuyizinkinga zobuchwepheshe izinkampani eziningi ezidinga ukuzixazulula ngokushesha. Kodwa-ke, izindlela zokwehluleka ezifana nokuwa, ukuguquka, ukuguguleka, ngisho nokuphuka zivame ukwenzeka ngesikhathi sokusetshenziswa kwe-isikhunta.Ngakho-ke namuhla, umhleli uzokunikeza isingeniso ngezindlela ezine zokulungisa isikhunta, ake sibheke.
Ukulungiswa kokushisela kwe-argon arc
Ukushisela kwenziwa ngokusebenzisa ukushiswa kwe-arc phakathi kwentambo yokushisela ephiswa njalo kanye ne-workpiece njengomthombo wokushisa, kanye ne-arc evikelwe yigesi efuthwa kusuka ku-nozzle yethoshi lokushisela. Njengamanje, ukushisela kwe-argon arc kuyindlela esetshenziswa kakhulu, engasetshenziswa ezinsimbini eziningi ezinkulu, kufaka phakathi insimbi yekhabhoni kanye nensimbi ye-alloy. Ukushisela kwe-MIG kufanelekile ensimbi engagqwali, i-aluminium, i-magnesium, ithusi, i-titanium, i-zirconium kanye ne-nickel alloys. Ngenxa yentengo yayo ephansi, isetshenziswa kabanzi ekushiseni isikhunta. Kodwa-ke, inezinkinga ezifana nendawo enkulu ethintekile ekushiseni kanye namajoyinti amakhulu e-solder. Ukulungiswa kwesikhunta okunembile kuye kwathathelwa indawo kancane kancane ngokushisela kwe-laser.
Ukulungiswa komshini wokulungisa isikhunta
IsikhuntaUmshini wokulungisa uwumshini wobuchwepheshe obuphezulu wokulungisa ukuguguleka kobuso besikhunta kanye nokucubungula amaphutha. Umshini wokulungisa isikhunta uqinisa isikhunta ukuze sibe nokuphila isikhathi eside kanye nezinzuzo ezinhle kwezomnotho. Izinhlobo ezahlukene ze-alloy ezisekelwe ensimbini (insimbi yekhabhoni, insimbi ye-alloy, insimbi ephonswe ngensimbi), i-alloy ezisekelwe ku-nickel nezinye izinto zensimbi zingasetshenziswa ukuqinisa nokulungisa ubuso besikhunta kanye nezinto zokusebenza, futhi kwandise kakhulu impilo yesevisi.
1. Umgomo womshini wokulungisa isikhunta
Isebenzisa umgomo wokukhipha inhlansi kagesi evame kakhulu ukulungisa amaphutha ebusweni kanye nokuguguleka kwensimbi.isikhuntangokushisela okungeyona into eshisayo endaweni yokusebenza. Isici esiyinhloko ukuthi indawo ethintekile ekushiseni incane, isikhunta ngeke siguqulwe ngemva kokulungiswa, ngaphandle kokufakwa kwe-anneal, akukho ukugxila kokucindezeleka, futhi akukho ukuqhekeka okubonakala kuqinisekisa ubuqotho besikhunta; ingasetshenziswa futhi ukuqinisa ubuso besikhunta ukuze kuhlangatshezwane nezidingo zokusebenza zokumelana nokuguguleka kwesikhunta, ukumelana nokushisa, kanye nokumelana nokugqwala.
2. Ububanzi besicelo
Umshini wokulungisa izikebhe ungasetshenziswa emishinini, ezimotweni, embonini elula, ezintweni zasendlini, embonini kaphethiloli, yamakhemikhali kanye neyamandla kagesi, ukuze kukhishwe izinto ezishisayoisikhunta, amathuluzi efilimu yokukhipha efudumele, isikhunta sokufaka esishisayo, ukulungiswa kwama-rolls nezingxenye ezibalulekile kanye nokwelashwa kokuqinisa indawo.
Isibonelo, umshini wokulungisa i-spark surfacing kagesi wohlobo lwe-ESD-05 ungasetshenziswa ukulungisa isikhunta sokufaka esigugile, imihuzuko kanye nemihuzuko, kanye nokulungisa ukugqwala, ukuwa kanye nomonakalo wesikhunta esikhipha insimbi njengesikhunta esikhipha insimbi esizinki-aluminium. Amandla omshini angama-900W, i-voltage yokufaka yi-AC220V, imvamisa ingu-50~500Hz, ububanzi be-voltage bungu-20~100V, kanti iphesenti lokukhipha lingu-10%~100%.
Ukulungiswa kwe-brush plating
Ubuchwepheshe bokufaka ibhulashi busebenzisa idivayisi ekhethekile yokuphakelwa kwamandla e-DC. I-positive pole yokunikezwa kwamandla ixhunywe epeni lokufaka i-anode ngesikhathi sokufaka ibhulashi; i-negative pole yokunikezwa kwamandla ixhunywe ku-workpiece njenge-cathode ngesikhathi sokufaka ibhulashi. I-plating pen ivame ukusebenzisa amabhlogo e-graphite acwebezelayo aphezulu njengezinto ze-anode, ibhloko le-graphite ligoqwe ngokotini kanye nesiketi sikakotini se-polyester esingagugi.
Uma usebenza, i-assembly yokuphakelwa kwamandla kagesi ilungiswa ku-voltage efanele, futhi ipeni lokufaka eligcwele isixazululo sokufaka lihanjiswa ngesivinini esithile engxenyeni yokuxhumana yobuso bento yokusebenza elungisiwe. Ama-ion ensimbi esisombululo sokufaka asakazeka kunto yokusebenza ngaphansi kwesenzo samandla kagesi. Ebusweni, ama-electron atholakala ebusweni ancishiswa abe ama-athomu ensimbi, ukuze lawa ma-athomu ensimbi abekwe futhi acwebezelwe ukuze akhe uqweqwe, okungukuthi, ukuthola ungqimba lokufaka oludingekayo olufanayo ebusweni bokusebenza bembobo yepulasitiki okufanele ilungiswe.
Umshini wokufaka i-plasma surface, umshini wokushisela we-plasma spray, ukulungiswa kokufakwa kwe-shaft surface
Ukulungiswa kwe-laser surface
Ukushisela nge-laser kuwukushisela lapho kusetshenziswa khona umsebe we-laser njengomthombo wokushisa ngokugxila ekusakazweni kwe-photon okuhlanganisiwe okunamandla aphezulu. Le ndlela yokushisela imvamisa ifaka phakathi ukushisela nge-laser okunamandla okuqhubekayo kanye nokushisela nge-laser okunamandla okucindezelayo. Inzuzo yokushisela nge-laser ukuthi akudingeki ukuthi kwenziwe endaweni evalekile, kodwa ububi ukuthi amandla angena ngaphakathi awanamandla njengoshisela nge-electron. Ukulawulwa kwamandla okunembile kungenziwa ngesikhathi sokushisela nge-laser, ukuze ukushisela kwamadivayisi anembile kubonakale. Kungasetshenziswa ezinsimbini eziningi, ikakhulukazi ukuxazulula ukushisela kwezinye izinsimbi ezinzima ukushisela kanye nezinsimbi ezingafani. Kusetshenziswe kabanziisikhuntaukulungiswa.
Ubuchwepheshe bokumboza nge-laser
Ubuchwepheshe bokumboza ubuso nge-laser buwukushisa nokuncibilikisa ngokushesha i-alloy powder noma i-ceramic powder kanye nobuso be-substrate ngaphansi kwesenzo se-laser beam. Ngemva kokuba i-beam isusiwe, ukupholisa okuzithokozisayo kwakha i-surface coating ene-dilution rate ephansi kakhulu kanye nenhlanganisela ye-metallurgical nezinto ze-substrate. , Ukuze kuthuthukiswe kakhulu ubuso be-substrate ukumelana nokuklwebheka, ukumelana nokugqwala, ukumelana nokushisa, ukumelana ne-oxidation kanye nezici zikagesi zendlela yokuqinisa ubuso.
Isibonelo, ngemva kokufakwa kwe-carbon-tungsten laser cladding yensimbi engu-60#, ubulukhuni bufika ku-2200HV noma ngaphezulu, kanti ukumelana nokuguguleka kuphindwe cishe izikhathi ezingu-20 kunensimbi eyisisekelo engu-60#. Ngemva kokufakwa kwe-laser cladding i-CoCrSiB alloy ebusweni bensimbi ye-Q235, ukumelana nokuguguleka kanye nokumelana nokuguguleka kokufutha ilangabi kwaqhathaniswa, futhi kwatholakala ukuthi ukumelana nokuguguleka kweyokuqala kwakuphakeme kakhulu kunokweyokugcina.
Ukumbozwa nge-laser kungahlukaniswa ngezigaba ezimbili ngokwezinqubo ezahlukene zokudla ngempuphu: indlela esethiwe kusengaphambili yempuphu kanye nendlela yokudla ngempuphu ehambisanayo. Imiphumela yalezi zindlela ezimbili iyafana. Indlela yokudla ngempuphu ehambisanayo inokulawula okuzenzakalelayo okulula, izinga eliphezulu lokumuncwa kwamandla e-laser, akukho zindawo zangaphakathi, ikakhulukazi i-cladding cermet, engathuthukisa kakhulu ukusebenza kokulwa nokuqhekeka kwesendlalelo sokumbozwa, ukuze isigaba se-ceramic esiqinile sibe nezinzuzo zokusatshalaliswa okufanayo kusendlalelo sokumbozwa.