Inqubo yokukhiqiza isibani se-PC

Ama-lampshade ayimikhiqizo evame kakhulu empilweni yansuku zonke. Izinto ezisetshenziswa kuma-lampshade e-PC empeleni ziyizinto ze-PC ezisakazwayo / izinto ze-PMMA. Singenza zombili lezi zinto ezimbili. Sineminyaka engaphezu kwengu-17 yesipiliyoni ekwenzeni isikhunta futhi sinezimo ezingaphezu kwe-100 zokukhiqiza ama-lampshade. Okulandelayo inqubo yokukhiqiza ama-lampshade

1. Ukuhlaziywa kwesidingo kanye nomklamo wedijithali

Ukumodela ukusebenza kokukhanya

Ukulingisa ukukhanya: Sebenzisa i-LightTools noma i-Zemax OpticStudio ukusungula imodeli yendlela yokukhanya ukuqinisekisa ukuthi ukuhanjiswa kokukhanya kwesithunzi sesibani kungu-≥92% (izici zezinto ze-PC) futhi ugweme ukukhanya okukhanyayo (UGR<19);

Ukuqinisekiswa kwesakhiwo: Sebenzisa i-topology ye-ANSYS ukuze ulungise ubukhulu bodonga lwesikhunta (olujwayelekile oluyi-1.5-3mm), ukulinganisela ukuqina okulula kanye nokumelana nokushayisana (olukwazi ukumelana nokushayisana kwebhola eliyi-3kg).

Umklamo we-3D wezikhunta

Isu lokuthayipha: Ezindaweni eziyinkimbinkimbi (njengamaphethini eFresnel), kusetshenziswa imigqa yokuthayipha engalingani, ehlanganiswe nendlela yokuxhuma induku yesilayidi enezinhlangothi ezintathu (ukubekezelelana kwe-angular ±0.01°);

Ukupholisa Okuhlelekile: Iziteshi zamanzi ze-titanium alloy eziphrintiwe nge-3D (ububanzi obungu-1.2-2mm) ziqinisekisa ukuthi ukushintshashintsha kwezinga lokushisa kwesikhunta kungu-≤±1.5℃, okuvimbela ukungcoliswa kokucindezeleka kwezinto ze-PC.

2. Ukulungisa ngokunemba kanye nokwelashwa kwendawo

Ubuchwepheshe obuyinhloko:

Ukugaya imigodi, umshini wokunemba okuphezulu onama-axis amahlanu (izixazululo ze-GF Machining), ubulukhuni bomphezulu Ra≤0.02μm

Ukuqopha kwesakhiwo esincane, i-laser ye-femtosecond + inqubo ye-nanoimprint ehlanganisiwe, ukujula kwe-Fresnel 0.05mm±0.003mm

Ukucutshungulwa kwama-electrode, ukucutshungulwa kokukhishwa kukagesi kwama-electrode e-graphite (igebe lokukhipha ugesi 0.03mm), i-edge R Angle ≤0.1mm

Ukwelashwa kokuqinisa ubuso

Ukupholisha kwebanga lokubona: Ukupholisha kwezigaba eziningi nge-diamond gypsum (kusukela ku-W40 kuya ku-W0.5), kuhlanganiswe nokupholisha kwe-magnetorheological (MRF) ukuze kuqedwe umonakalo ongaphansi komhlaba;

Ukugqoka okunganamatheli: Ukugqoka okufana ne-carbon (DLC) okufana nedayimane (okunobukhulu obungu-2-3μm) kunciphisa amandla okususa uthuli abe ngaphansi kuka-5kN futhi kwandisa impilo yesikhunta ibe yizikhunta ezingu-800,000

3. Ukuqinisekiswa kwesilingo sesikhunta kanye nokwenza ngcono ukukhiqizwa kwesisindo

Iwindi lenqubo yokubumba ngomjovo

Ukulawula izinga lokushisa: Izinga lokushisa lemigqomo engu-280-310℃ (i-PC melt index engu-18g/10min), izinga lokushisa lesikhunta elingu-90-110℃ (ukuvimbela ukuklwebheka kwezinto ezibandayo);

Ijika lokucindezela: Ukubamba ingcindezi yezigaba ezintathu (60MPa→45MPa→30MPa), izinga lokuncipha kwesinxephezelo lingu-0.6-0.8%.

Ukulungiswa kwe-closed-loop okuphelele

Umugqa wokushisela uyathuthukiswa futhi indawo yesango ayifaneleki, okuholela ekuhlanganeni kokugeleza okuningi. Lungisa isikhathi senaliti ye-hot runner valve (iphutha ±5ms)

Ukuguqulwa kwamabala, ukuwohloka kwesakhiwo esincane sesikhunta noma ukupholisha okungalingani, ukushisela ukulungiswa kwendawo + ukwakheka kwe-ion beam (inani lokulungisa lingu-0.005mm)

Ukuqhekeka kokucindezeleka, ukuthambekela okunganele kokudiliza (<1°) noma isivinini sokudiliza esisheshayo kakhulu, kwandisa inani lamaphini okudiliza (1 ku-100cm²)

4. Amaphuzu abalulekile okukhiqizwa kwesikhunta somjovo:

Ukusebenza okubonakalayo kanye nomklamo wesakhiwo

Ukudluliselwa kokukhanya kanye nokulawulwa kwendlela ebonakalayo

Isakhiwo esincane somphezulu: Umklamo welensi ye-Nanoscale Fresnel (ukunemba kokujula ±0.003mm), ofinyelelwa ngezinqubo zokuchoboza nge-laser noma izinqubo ze-electroplating, nge-engeli yokusabalalisa ukukhanya engu-≤15° kanye nokugwema ukukhanya okukhanyayo (inani le-UGR kudingeka libe <16);

Ukufana kobukhulu bodonga: I-algorithm yokwenza ngcono i-topological (i-ANSYS Discovery) iyasetshenziswa ukulinganisela ukudluliselwa kokukhanya kanye nokuqina. Ukujiya kodonga kungu-1.2-2.5mm, futhi ukubekezelelana kulawulwa ngaphakathi kuka-±0.05mm. Imigqa yokuhlukanisa namasu okususa ukukhanya

Ukuhlukana okungalingani: Ezindaweni ezigobile ezingajwayelekile (njengezibani ezimise okwe-petal), kusetshenziswa amaslayida e-3D kanye nezinduku zokuxhuma ezidonsa i-hydraulic core. I-Angle ye-offset yomugqa wokuhlukana ingu-≤0.5° ukuqinisekisa ukuthi akukho ukukhanya.

Ukwehla kokwehla: Ukwehla kobuso obubonakalayo ≥1.5°, kanye nokwehla kobuso obungeyona i-optical ≥0.8°. Uhlelo lokukhipha lusebenzisa amaphini okukhipha i-silicon nitride ceramic (i-friction coefficient <0.1).

Ukwenziwa ngcono kokubambisana kwezinto kanye nenqubo

Ukukhethwa kwensimbi yokubumba

Insimbi epholishiwe kakhulu: I-S136 SUPREME (HRC 52-54) noma i-German Gritz 1.2085 ESR (epholishiwe esibukweni kuya ku-Ra 0.008μm) iyathandwa;

Ukwelashwa okumelana nokugqwala: Ubuso bumbozwe ngesendlalelo sekhabhoni efana nedayimane (i-DLC) (ubukhulu obungu-2-3μm), esingamelana namagesi ane-asidi akhiqizwa ukubola kwe-PC okushisa okuphezulu.

Uma ufuna ukwenza ngokwezifiso isibani se-PC esifanayo, ungeza kithi. Singabelana ngamakesi amaningi esiwenzile, okukuvumela ukuthi ubone ikhwalithi yethu futhi uzwe isevisi yethu.